@INPROCEEDINGS{MaaB2007,
  author = {MaaB, Uwe and Polityko, David Dmitry and Richter, Christian and Ndip,
	Ivan and Hefer, Jan and Guttowski, Stephan and Reichl, Herbert},
  title = {Linking Geometrical and Electrical Parameters of Flex Substrate Vertical
	Interconnects for 2.5D System-in-Package Design},
  booktitle = {Electronic Components and Technology Conference, 2007. ECTC '07.
	Proceedings. 57th},
  year = {2007},
  pages = {1861--1865},
  month = {May 29 2007-June 1},
  abstract = {Flexible substrate are gaining more and more in importance in different
	electronics area. One of the methods to achieve vertical integration
	within System-in-Package (SiP) approach is folding of substrates.
	The behavior of the folded segments, which are acting as vertical
	interconnects will be discussed in this paper from geometrical and
	electrical point of view.},
  doi = {10.1109/ECTC.2007.374051},
  isbn = {1-4244-0985-3},
  issn = {0569-5503},
  owner = {richter},
  pdf = {MaaB2007.pdf},
  timestamp = {2007.11.23}
}