@INPROCEEDINGS{Richter07-EPTC,
  author = {Christian Richter AND David Dimitry Polityko AND Jan Hefer AND Stephan
	Guttowski AND Herbert Reichl AND Martin Berger AND Uwe Nowak AND
	Michael Schroeder},
  title = {Technology Aware Modeling of 2.5D-SiP for Automation in Physical
	Design},
  booktitle = {Proceedings of 9th Electronics Packaging Technology Conference (EPTC)},
  year = {2007},
  editor = {9th Electronics Packaging Technology Conference (EPTC)},
  volume = {9},
  number = {07EX1831C},
  address = {Singapore},
  month = {12},
  organization = {IEEE-CPMT},
  publisher = {IEEE},
  abstract = {The vertical integration within the System-in-Package (SiP) approach
	is becoming more and more important. While System-on-Chip (SoC) and
	PCB design teams are operating with highly developed EDA tools, there
	is a lack of automation tools for the design of SiP. This is particularly
	true for the engineering of so called 2.5D SiP, which integrate heterogeneous
	components (IC's, passives etc.) over several vertical layers/modules.
	For these systems component placement today is a time consuming task.
	Even more important is the lack of a tool support for technology
	selection. This paper presents a new method for component autoplacement
	for folded and stacked 2.5D SiP integrated with technology selection
	on an objective basis. We propose a design approach that is based
	on the simultaneous consideration of numerous layout solutions.
	
	We discuss the structuring of physical design, present a novel modeling
	of technological components for folded and stacked 2.5D SiP, and
	sketch algorithms for technology constrained automated placement,
	based on multicriteria optimization. Together with a multicriteria
	decision support tool this results in a novel design approach for
	2.5D SiP.},
  isbn = {1-4244-1323-0},
  owner = {richter},
  pdf = {IEEE\EPTC07-Technology_aware_modeling.pdf},
  timestamp = {2007.10.12}
}